Job Details

Posting Date : 02 Jul 2025 | Closing Date :31 Aug 2025

Job Description:

Research Engineer will be part of heterogeneous integration group focused on development of the advanced packaging technology platforms for multi-chip wafer level package. He/she will work on the following tasks:

Process development for multi-chip WLP for various applications such as Chiplets packaging for high power computing, Co-package Optics, Power devices etc.

Plan and perform DOEs for various process development and materials evaluation for WLP

Establish integration flows for advanced packages

Coordinate and support engineering build of new packages and development

Work with industry partners and multidisciplinary team members to execute assigned tasks and resolve issues for projects

Publish new findings and technological advancement in prestigious journals and overseas/local conferences.

Job Requirements

University degree or Masters in Electronics / Microelectronics / Material Engineering / Material Science / Chemistry / Physics.

Knowledge of advanced packaging technologies such as photolithography, ECP, PVD, plasma and wet etching is preferred

Good analytical, communication and presentation skills

The above eligibility criteria are not exhaustive. A*STAR may include additional selection criteria based on its prevailing recruitment policies. These policies may be amended from time to time without notice. We regret that only shortlisted candidates will be notified.